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1991 IEEE Workshop on Charge-Coupled Devices

June 7-9, 1991, Waterloo, Canada

 

Cover, Welcome, Agenda

Savvas G. Chamberlain
University of Waterloo
Waterloo, Canada

 # pages

10
8.10 a.m.

Sat. 1

Fabrication Techniques for CCD’s for Performance and Yield 

Richard A. Bredthauer
Loral Fairchild
Newport Beach, CA 92658-8900

 0
9.05 a.m.

Sat. 2

III-V CCDs

Eric R. Fossum
Jet Propulsion Laboratory (NASA)
California Institute of Technology
Pasadena, CA

 88
9.55 a.m.

Sat. 3

Future Development for Thinned Back-illuminated CCD Imagers

Chin-Ming Huang
Lincoln Laboratory
Massachusetts Institute of Technology
Lexington, MA 02173-9108

 32
11.05 a.m.

Sat. 4

Low Noise Charge Sensing at the Output of a CCD

K. Kandiah and F.B. Whiting
Rutherford Appleton Laboratory Chilton
Oxon OX11 OQX, United Kingdom.

 36
12.00 noon

Sat.5

Models of the back surface of thinned CCD’s

Morley M. Blouke
Tektronix Inc.
Beaverton,OR 97077

 14
1.30 p.m.

Sat. 6

CCD Device Development for use in High-speed sampled analog signal processing

 

J. D. Strombosky, R.H. Whiting,
C.W. Christensen, D. McClure, R.L. Wixted
Massachusetts Institute of Technology
Lincoln Laboratory
Lexington, MA 02173-0073

 38
2.25 p.m.

Sat. 7

Semiconductor Device Simulation for CCDs Using Drift-Diffusion and Hydrodynamic Formulations

John R.F. McMacken, Savvas G. Chamberlain
Electrical and Computer Engineering Dept.
University of Waterloo
Waterloo, Ontario Canada N2L 301

 89
3.30 p.m.

Sat. 8

An Overview of the Schottky-Barrier

Imager Technology

reprint 1     reprint 2

Walter F. Kosonocky
New Jersey Institute of Technology
Newark, NJ 07102

 26, 12
4.25 p.m.

Sat. 9

Design and performance considerations for CCD’s in acousto-optical channelizers

Stephen Strunk, William D. Washkurak
DALSA INC.
Waterloo, Ont. Canada N2V 2E9

 41
5.20 p.m.

Sat. 10

Design of Solid-State Imaging Arrays

chap 1  chap2  notes

Marvin H. White
Lehigh University
Bethlehem, PA 18015

 38,30,20
8.10 a.m.

Sun. 1

A Review of Photo Detector Elements for Interline CCD

T.R. Lee, B. C. Burkey
Eastman Kodak Company
Rochester, NY 14650-2008 USA

 76
9.05 p.m.

Sun. 2

Time Delay and Integration (TDI) Charge Coupled Device (CCD): Device design and applications

Hon-Sum Philip Wong, Ying L. Yao,
Eugene S. Schlig
IBM Thomas J. Watson Research Center
Yorktown Heights, NY 10598, USA.

 52
10.00 a.m.

Sun. 3

An MTF measurement technique for small Pixel Imagers

Mike Marchywka*, Dennis G. Socker
Naval Research Laboratory
Washington, DC 20375-5000
*Interferometrics Inc. USA.

 18
10.40 a.m.

Sun. 4

Modulation Transfer Function (MTF) of CCD Imagers: Utility, Models, and Measurement Methods

Terrence S. Lomheim
The Aerospace Corporation
Los Angeles, CA 90009-2957

 42
11.35 a.m.

Sun. 5

CCD Image Sensors for HDTV

Nobukazu Teranishi
NEC Corporation
1120, Shimokuzawa, Sagamihara
Kanagawa 229, Japan

 28
  690