WORKSHOP PAPER
Investigation of Implantation Damage Recovery using Microwave Annealing for High Performance Image Sensing Devices.
Masatoshi Kimura1, Tadashi Yamaguchi2, Takashi Kuroi1
1Technology Division, Renesas Semiconductor Manufacturing Corp., 751 Horiguchi, Hitachinaka, Ibaraki, 312-8504, Japan
2Production Technology Development Unit, Renesas Electronics Corp., 751 Horiguchi, Hitachinaka, Ibaraki, 312-8504, Japan

Abstract

We propose a novel annealing technique in order to improve the dark characteristics for CMOS image sensor without deteriorating transistor characteristics. Microwave annealing (MWA) has been studied as an alternative annealing technique for diffusion-less dopant activation in advanced CMOS technology. We employed MWA technique in order to recover crystalline defects in CMOS image sensor (CIS) process. We demonstrate that MWA can be implemented a low thermal budget to obtain the effect of repairing the ion-implantation damage equivalent to conventional furnace annealing (FA). MWA can repair the process damage without transistor performance degradation by additional thermal treatment. MWA is promising technique for repairing crystalline defects in high performance image sensing devices with high frame rate, low power and excellent dark characteristics.
Publisher: IISS (Int. Image Sensors Society)
Year: 2015
Workshop: IISW
URL: https://doi.org/10.60928/7jcl-h78a

Keywords

Microwave Annealing, CMOS Image Sensor, Implantation Damage Recovery,

References

1) F. Domengie et al., IRPS, 2010
2) T. Yamaguchi et al., IWJT, 2014
3) T. Iwai et al., Proc. 36th DPS, 2014
4) M. Iwane et al., Proc. of 2007 International Image Sensors Workshop, 2007