WORKSHOP PAPER
Fully Depleted CIS Pixel Using Reverse Substrate Bias without Undesirable Leakage Currents
Abstract
Earlier, IMEC has demonstrated a fully depleted CIS pixel device with a sufficiently large reverse substrate bias or back bias. In this paper, we report an updated device structure that circumvents the die leakage and punch-through in the peripheral circuit area and is used in an ultra-high speed CMOS image sensor. The updated device structure is designed and studied through TCAD simulations and validated through leakage measurement and pixel characterization.Keywords
fully depleted, CIS pixel, reverse substrate bias, leakage currents, ultra-high speed, CMOS image sensor,References
1) V. T. S. Dao et al., "Toward 10 Gfps: Factors Limiting the Frame Rate of The BSI MCG Image Sensor", IISW 2015, June 2015
2) T. Resetar et al., "Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging", Sensors 2016, 16, 1294, Aug. 2016. https://doi.org/10.3390/s16081294
3) M. Havranek et al., "DMAPS: A Fully Depleted Monolithic Active Pixel Sensor – Analog Performance Characterization", 2015 JINST 10 P02013, Feb. 2015. https://doi.org/10.1088/1748-0221/10/02/p02013
4) P. Rymaszewski et al., "Prototype Active Silicon Sensor in 150 nm HR-CMOS Technology for ATLAS Inner Detector Upgrade", 2016 JINST 11 C02045, Feb. 2016. https://doi.org/10.1088/1748-0221/11/02/c02045
5) K. D. Stefanov, A. S. Clarke and A. D. Holland, "Fully Depleted Pinned Photodiode CMOS Image Sensor With Reverse Substrate Bias", IEEE Electron Device Letters, vol. 38, no. 1, pp. 64-66, Jan. 2017. https://doi.org/10.1109/led.2016.2625745
6) Lucio Pancheri st al., "A 110nm CMOS process with fully depleted high resistivity substrate for NIR, X-ray and charged particle imaging", IISW, 2019
7) A. Payne et al., "A 512x424 CMOS 3D Time-of-Flight Image Sensor with Multi-Frequency Photo-Demodulation up to 130 MHz and 2GS/s ADC", ISSCC 2014, pp. 134-136, Feb. 2014. https://doi.org/10.1109/isscc.2014.6757370
8) A. Clarke et al., "Fully depleted, thick, monolithic CMOS pixels with high quantum efficiency", 2015 JINST 10 T04005, April 2015. https://doi.org/10.1088/1748-0221/10/04/t04005
9) , "Imec’s white paper about “monolithic microsystems”", https://www.imec-int.com/en/what-we-offer/design-and-foundry-services/white-paper-monolithic-microsystems
10) A. Süss, L. Wu, J.-L. Bacq, A. Spagnolo, P. Coppejans, V. Motsnyi, L. Haspeslagh, J. Borremans and M. Rosmeulen, "A Fully Depleted 52 μm GS CIS Pixel with 6 ns Charge Transfer, 7 e-rms Read Noise, 80 μV/e- CG and >80 % VIS-QE", IISW, 2017
