WORKSHOP PAPER
Monolithic and Fully-Hybrid Backside Illuminated CMOS Imagers for Smart Sensing
Abstract
Backside-thinned monolithic and fully-hybrid CMOS imagers possessing excellent imaging properties have been successfully designed, fabricated and tested. The document discusses the design, fabrication, and testing of both monolithic and fully-hybrid imagers, including their pixel structures, thinned detector arrays, and optimization for increased Quantum Efficiency through Anti Reflective Coating. It also covers backside thinning and processing techniques and the high yield of pixel and bump yield. The paper further explores improvements in crosstalk performance, sensor assembly images, and sensitivity to extreme ultra violet light. Finally, advancements into multi-layer 3D integrated systems for smart sensing applications using unique sensor designs are outlined.Keywords
CMOS imagers, Backside illumination, 3D integration,References
1) J. Bogaerts, B. Dierickx, C. Van Hoof, P. De Moor , D. Sabuncuoglu Tezcan, and K. De Munck, "High-end CMOS Active Pixel Sensor for Hyperspectral Imaging", Proceedings of IEEE International Workshop on CCD and Advanced Image Sensors, p39-43, June 9-11, 2005, Nagano, Japan., 2005
2) K. De Munck, J. Vaes, L. Bogaerts, P. De Moor, C. Van Hoof and B. Swinnen, "Grinding and Mixed Silicon Copper CMP of Stacked Patterned Wafers for 3D Integration", MRS 2006, Nov.27 – Dec.1, Boston, US, 2006. https://doi.org/10.1557/proc-0970-y06-03
3) K. De Munck, L. Bogaerts, D. S. Tezcan, P. De Moor, B. Swinnen, K. Baert and C. Van Hoof, "Wafer Level Temporary Bonding/Debonding for Thin Wafer Handling Applications", IMAPS 2006, March 20-23, Scottsdale, US, 2006
4) B. Dierickx, and J. Bogaerts, "NIR-enhanced image sensor using multiple epitaxial layers", Proceedings of the SPIE - The International Society for Optical Engineering, vol.5301, no.1, p205-12, 2004., 2004. https://doi.org/10.1117/12.525726
5) K. Minoglou et al., "Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation", IITC Conf., pp. 129-131, 2008., 2008. https://doi.org/10.1109/iitc.2008.4546945