WORKSHOP PAPER
The State-of-the-Art of Mainstream CMOS Image Sensors
Ray Fontaine1
1Competitive Technical Intelligence Group, Chipworks, Inc., 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7, Canada

Abstract

The steady growth of mobile phones sales (feature and smartphones) has been the primary driver for CMOS image sensor (CIS) unit shipment growth over the last 3-5 years. As CIS market revenue has grown, so have R&D spending and patent filings. This effort has resulted in advanced mobile camera systems containing phase detection pixel arrays for fast autofocus (AF), ~1 µm generation pixels with improved low-light sensitivity, advanced chip-stacking, featuring a back-illuminated CIS wafer joined with an image signal processor (ISP) wafer, and video recording up to 4K. Innovation for smartphone cameras will continue, although given the competition for these high-volume sockets, many IDMs and fabless companies are developing chips for emerging, higher margin imaging applications such as automotive, security, medical, etc. These emerging opportunities are driving technology transfers from mobile imaging to these growth areas.
Publisher: IISS (Int. Image Sensors Society)
Year: 2015
Workshop: IISW
URL: https://doi.org/10.60928/ivnk-xiq9

Keywords

CMOS Image Sensors, Mobile Imaging, Advanced Chip-Stacking,

References

1) P. Cambou, J. Jaffard, "Status of the CMOS Image Sensor Industry 2015 Report", February 2015, 2015
2) R. Fontaine, et al., "ChipSelect for Image Sensors (ChipSelectIS) Subscription Service", Chipworks
3) H. Watanabe, et al., "A 1.4μm front-side illuminated image sensor with novel light guiding structure consisting of stacked lightpipes", IEDM 2011, 2011. https://doi.org/10.1109/iedm.2011.6131513
4) R. Krishnamurthy, et al., "Sony IMX214 Second Generation 13 MP Exmor RS™ Stacked BSI CIS with SME-HDR", Chipworks, March 2015, 2015
5) Sony product literature, "IMX214 – Diagonal 5.867 mm (Type 1/3.06) Image 13.13M-Effective Pixel Stacked CMOS Image Sensor"