WORKSHOP PAPER
A Quantum-dot-based CMOS Image Sensor with Direct X-ray Conversion for Nondestructive Testing
Chun-Min Zhang1, Riccardo Quaglia, Artem Shulga2, Vincent Goossens, Paula Blanca Cruz, Rémy Vuagniaux, Pierre-François Rüedi
1Edge AI & Vision Systems Group, Centre Suisse d’Electronique et de Microtechnique (CSEM), Neuchâtel, 2002, Switzerland
2QDI Systems, Groningen, 9713, The Netherlands

Abstract

This paper presents the promising use of our newly developed X-ray image sensor in nondestructive test for industrial inspection. It consists of an absorber stack with a 120-μm layer of lead sulfide (PbS) colloidal quantum dots (CQDs) monolithically and directly deposited on a CMOS readout chip. This combination leverages both CMOS processes and PbS CQDs to achieve high X-ray absorption efficiency, thin-film integration, low power consumption, high pixel resolution, efficient readout electronics, and a 100% fill factor...
Year: 2025
Workshop: IISW
URL: https://doi.org/10.60928/p7lo-ek4x
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Keywords

CMOS readout, colloidal quantum dots, composite materials, CQDs, direct conversion, industrial inspection, lead sulfide, monolithic integration, nondestructive test, NDT, PCB, printed circuit boards, PbS, quantum dots, X-ray imaging,

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