WORKSHOP PAPER
State-of-the-Art CMOS Image Sensors: Looking Under the Hood
Daniel McGrath1
1TechInsights, San Jose, CA, USA

Abstract

Pixel development over the last five decades has been on a trajectory that adds process complexity to achieve the performance required for imaging. This paper discusses the challenges and advancements in image sensor technology, including process enhancements, enabling structures, stacking technology, interconnects, and capacitors. The author emphasizes the importance of continued technology development and the wide horizon ahead.
Year: 2025
Workshop: IISW
URL: https://doi.org/10.60928/ueuo-q0b0
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Keywords

CMOS image sensors, pixel development, process enhancements, stacking technology, interconnects, capacitors,

References

1) Gwi-Deok Ryan Lee, et al., "A 0.5μm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu", IEDM (2023), 2023. https://doi.org/10.1109/ectc51529.2024.00070