WORKSHOP PAPER
A 40/22nm 200M P Stacked CMOS Image Sensor with 0.61µm Pixel
Masayuki Uchiyama1, Geunsook Park1, Sangjoo Lee1, Tomoyasu Tate1, Masa Shi Minagawa2, Shino Shimoyamada2, Zhiqiang Lin1, King W. Yeung1, Lien Tu1, Wu-Zang Yang3, Alan Chih-Wei Hsiung1, Vincent C. Venezia1, Lindsay A. Grant1
1OmniVision Technologies, Santa Clara, CA 95054, USA
2OmniVision Technologies Japan, Kanagawa, Japan
3OmniVision Technologies Taiwan, Hsinchu, Taiwan

Abstract

We developed a new 40/22nm stacked 200 mega-pixel CMOS image sensor (CIS) with a 0.61 µm pixel. By using a 22nm logic wafer process node instead of 40nm , digital power consumption was reduced by half while keeping the same clock frequency, and the full high definition (FHD) frame rate was increased from 240fps to 480fps. In this work, we demonstrate a new source follower (SF) transistor architecture with 63% higher SF transconductance (Gm) compared with our former 0.7 µm pixel. A full well capacity (FWC) of 5.0ke- was achieved without lag or blooming, with better white pixel (WP) performance compared to the 0.7µm pixel. We demonstrate a 0.61µm quad photodiode (QPD) structure capable of achieving comparable quantum efficiency (QE) performance to 0.7 µm QPD in the visible light range.
Publisher: IISS (Int. Image Sensors Society)
Year: 2021
Workshop: IISW
URL: https://doi.org/10.60928/vt74-nsnt

Keywords

CMOS Image Sensor, Pixel Technology, Quantum Efficiency,

References

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