Snowbird, Utah, USA
June 23-27, 2019
General Workshop Co-Chairs
Michelle (Yibing) Wang (Samsung) and Daniel Van Blerkom (Forza-Ametek)
Technical Program Chair
Vladi Korobov (ON Semiconductor)
Final Call for Papers Link
Technical Program Link
MDPI Sensors Special Issue on IISW’19 Link
New! Papers available for download Link
Sponsors/Co-sponsors
For information:
Confidentiality agreement for TPC members
Link to Donation Policies